2012mm,FMXMC12S12FC-32.768K-TR,FMXMC12S晶體,FMI音叉晶振,歐美進(jìn)口晶振,美國FMI晶振,2012mm超小型晶振,無源貼片晶振,32.768K晶振,無源晶振,兩腳貼片晶振,尺寸2.0x1.2mm,頻率32.768KHZ,負(fù)載12.5pF,高穩(wěn)定晶振,高質(zhì)量晶振,低功耗晶振,低損耗晶振,數(shù)字顯示晶振,實(shí)時(shí)實(shí)時(shí)晶振,電話機(jī)晶振,智能手表晶振,無線設(shè)備晶振.
2012mm,FMXMC12S12FC-32.768K-TR,FMXMC12S晶體,FMI音叉晶振特點(diǎn):
表面貼裝陶瓷組件。
Micro 2 x 1.2/超薄
32.768千赫貼片無源晶振
緊密穩(wěn)定性
2012mm,FMXMC12S12FC-32.768K-TR,FMXMC12S晶體,FMI音叉晶振 參數(shù)表
| Parameter | Specification | ||||||||||||||
| Frequency | 32.768 kHz | ||||||||||||||
| Load Capacitance (CL) | 9.0 pF or 12.5 pF | ||||||||||||||
| Frequency Tolerance | ±20 ppm or ±50 @ 25°C | ||||||||||||||
| Turnover Temperature | +25°C ppm ±5°C | ||||||||||||||
| Temperature Coefficient | (-3.5 ±1.0) X 10-8/ºC2 | ||||||||||||||
| Operating Temperature | -40 to +85°C | ||||||||||||||
| Equivalent Series Resistance (ESR) | 90 KΩ max | ||||||||||||||
| Drive Level | 0.1 µWtypical, 0.5 µW max | ||||||||||||||
| Aging @ +25°C | ±5 ppm per year max | ||||||||||||||
| Reflow Conditions | +260ºC ±10ºC for 10 sec max, 2 reflows max | ||||||||||||||
2012mm,FMXMC12S12FC-32.768K-TR,FMXMC12S晶體,FMI音叉晶振 尺寸圖
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FC7ASBBMM16.0-T1,FOX安防設(shè)備晶振,7050mm,陶瓷諧振器
無源晶體,石英晶振,ENN002-17007晶振,NAKA納卡晶體
C32石英諧振器,CORE科爾晶振,無源貼片晶體,進(jìn)口無源晶振
49貼片晶振,GSX49-3晶體,Golledge諧振器,進(jìn)口石英晶振,GSX49-3/351DF-25MHz晶體
