頻率:48.000MHz
尺寸:1.6x1.2mm
可穿戴設備6G晶振,QESM10115DT101048.000MHz,Rakon超小型晶振,新西蘭進口晶振,Rakon瑞康晶振,型號:QESM10,編碼為:QESM10115DT101048.000MHz,頻率為:48.000MHz,小體積晶振尺寸:1.6*1.2晶振,四腳貼片晶振,SMD石英晶體,石英晶振,石英晶體諧振器,無鉛晶振,貼片石英晶振,工作溫度范圍:-40℃至+85℃。具有超小型,輕薄型,高精度,高性能,高品質,高質量,耐熱及耐環境特點。無源晶振,被廣泛應用于:可穿戴設備,小型便捷式設備,通訊設備,無線網絡,藍牙模塊,物聯網,汽車電子,游戲機設備,醫療設備,安防設備,智能手機,平板電腦,數碼電子,智能家居等應用。
可穿戴設備6G晶振,QESM10115DT101048.000MHz,Rakon超小型晶振 參數表
Parameter
Min
Typ
Max
Unit
Test condition / Description
Nominal frequency (Fn)
48
MHz
Calibration tolerance
±10 to ±30
ppm
Frequency at 25°C ± 2°C and
specified load capacitance
Reflow shift
±1
ppm
Frequency shift after reflow with 4
hours settling at 25°C
Operating Temperature Range
-20 to +70
-40 to +85
°C
Refer to ordering information
Storage Temperature Range
-55
+125
°C
Frequency stability
over temperature
±10 to
±30
ppm
Referenced to frequency reading at
25°C and the specified load
capacitance
Long-term stability (Ageing)
±2
ppm
Frequency drift over 1 year at 25°C
g sensitivity
2
ppb/g
Gamma vector of all three axes from
30 Hz to 1500 Hz
Shunt capacitance (CO)
3.0
pF
Load capacitance (CL)
5
32
pF
Refer to ordering information
Drive level
10
100
µW
Equivalent series resistance (ESR)
24.000 to 29.999MHz
30.000 to 54.000MHz
100
80
Ω
Mode of vibration:
Fundamental (AT-cut)
Fundamental (AT-cut)
Insulation resistance (IR)
500
MΩ
100 V ±15 V at 25°C
可穿戴設備6G晶振,QESM10115DT101048.000MHz,Rakon超小型晶振 尺寸圖
可穿戴設備6G晶振,QESM10115DT101048.000MHz,Rakon超小型晶振
1612mm體積的晶振,可以說是目前小型數碼產品的福音,目前超小型的智能手機里面所應用的就是小型的石英晶振,該產品最適用于無線通訊系統,無線局域網,已實現低相位噪聲,低電壓,低消費電流和高穩定度,超小型,質量輕等產品特點,產品本身編帶包裝方式,可對應自動高速貼片機應用,以及高溫回流焊接(產品無鉛對應),為無鉛產品.