頻率:32.768KHZ
尺寸:2.0x1.2mm
2012mm,FMXMC12S12FC-32.768K-TR,FMXMC12S晶體,FMI音叉晶振,歐美進口晶振,美國FMI晶振,2012mm超小型晶振,無源貼片晶振,32.768K晶振,無源晶振,兩腳貼片晶振,尺寸2.0x1.2mm,頻率32.768KHZ,負載12.5pF,高穩定晶振,高質量晶振,低功耗晶振,低損耗晶振,數字顯示晶振,實時實時晶振,電話機晶振,智能手表晶振,無線設備晶振.
2012mm,FMXMC12S12FC-32.768K-TR,FMXMC12S晶體,FMI音叉晶振特點:
表面貼裝陶瓷組件。
Micro 2 x 1.2/超薄
32.768千赫貼片無源晶振
緊密穩定性
2012mm,FMXMC12S12FC-32.768K-TR,FMXMC12S晶體,FMI音叉晶振 參數表
Parameter | Specification | ||||||||||||||
Frequency | 32.768 kHz | ||||||||||||||
Load Capacitance (CL) | 9.0 pF or 12.5 pF | ||||||||||||||
Frequency Tolerance | ±20 ppm or ±50 @ 25°C | ||||||||||||||
Turnover Temperature | +25°C ppm ±5°C | ||||||||||||||
Temperature Coefficient | (-3.5 ±1.0) X 10-8/ºC2 | ||||||||||||||
Operating Temperature | -40 to +85°C | ||||||||||||||
Equivalent Series Resistance (ESR) | 90 KΩ max | ||||||||||||||
Drive Level | 0.1 µWtypical, 0.5 µW max | ||||||||||||||
Aging @ +25°C | ±5 ppm per year max | ||||||||||||||
Reflow Conditions | +260ºC ±10ºC for 10 sec max, 2 reflows max |
2012mm,FMXMC12S12FC-32.768K-TR,FMXMC12S晶體,FMI音叉晶振 尺寸圖